NXP eScooter: Physical & Virtual Product Presentation at CES 2023

Solidsense
© Markus Burkhardt Fotografie
© Markus Burkhardt Fotografie
© Markus Burkhardt Fotografie
© Markus Burkhardt Fotografie
Published in the
Eventdesign Yearbook 2023/24
Book cover

Description

The first realisation of a hybrid exhibition presence in January 2022 led the international semiconductor manufacturer NXP® Semiconductors to also conceive of individual exhibits as hybrid. One of the first examples of this was designed to take up the topic of electromobility for small vehicles and present how their own solutions contribute to the mobility of the future and make it sustainable, safe and intelligent.

One of the challenges was that such a hybrid exhibit had to be capable of conveying the same content both physically and virtually, presenting both components and solutions. In addition, it was to serve the purpose of pursuing engaging forms of contact during physical events as well as providing more in-depth content on a virtual level. Due to the existing NXP Virtual Technology Showroom, the virtual possibilities in the form of a 3D animated demo were already known and it was a case of linking them to a physical presence.

The physical exhibit in the form of a transparent eScooter including all the components and communication channels was virtually recreated and the original was presented synchronously with its simulation. The backend of the virtual applications was extended, so that the digital twin could control the presentation at the physical exhibit at the same time. A control stele on the eScooter made it possible to experience the demo on a touchscreen.

It could therefore be presented by a live presenter as well as explored independently. In accordance with the virtually displayed procedures, the respective components and communication channels of the exhibit were highlighted with LEDs and explained. To round off its hybridity, it was also placed on an LED floor that represented the base in accordance with the virtual animation.

Details

Agency
Solidsense
Client
NXP Semiconductors
Year
2023
City
Las Vegas
Country
USA
Architecture / Design
Viadescon Designkonzeption & -beratung Rico Knöll, b.nz | Sebastian Binz Design
Lighting
Go development
Media
FRIDIE | Fritz & Dietrich
Decoration
Das Schauwerk, Kümpel Kunststoff-Verarbeitungswerk
Construction
Solidsense

Categories

Industry
Electronics & Technology
Location
Fair Hall
Topic
Analogue, B2B, Digital, Interactive, Learning, Sculpture, Technology
Type
Booth, Interactive Installation, Product Showcase